HIGH VISCOSITY THERMAL PUTTY TECHNICAL DATA SHEET (TDS)

Product Overview

PRION High Viscosity Thermal Putty is a premium-grade, highly efficient thermal interface material
specifically engineered for high-performance electronic systems, LED modules, and advanced circuit boards
(PCBs). Designed to fill irregular gaps, air pockets, and micro-spaces between heat-generating components
and their enclosures or heatsinks, it ensures rapid and uniform heat dissipation to protect sensitive electronics
from thermal stress.

Key Advantage: Formulated with superior non-conductive electrical properties, PRION Thermal
Putty provides exceptional safety with minimal electrical leakage, outperforming standard
market alternatives in high-voltage industrial applications.

                 Key Applications

 • High-Power LED Modules: Facilitates ultra-fast heat transfer to the outer casing, significantly extending
LED lifespan and maintaining lumen efficiency.
•Electronic Control Units (ECUs) & PCBs: Ideal for complex components with variable heights where
traditional thermal pads fail to conform.
• Automotive & Defense Electronics: Provides stable thermal connection under heavy vibration and
mechanical shocks.
• Power Supplies & Inverters: Dissipates concentrated heat loads safely away from MOSFETs and power
transistors.

                     Features & Benefits

   • Excellent Thermal Conductivity: Accelerates heat transfer directly to the chassis or cooling element.
   •High Electrical Isolation: Engineered to eliminate short circuits, offering superior dielectric breakdown
resistance compared to conventional alternatives.
• High Conformance & Low Compression Stress: Easily flows into complex microstructures without
putting structural pressure on delicate solder joints.
• No Curing or Drying: Maintains its optimal semi-solid putty consistency indefinitely without cracking or
separating over time.

               Usage & Application Guidelines

    Ensure all contact surfaces are clean, dry, and free of dust or grease prior to application. Apply the required
amount of PRION Thermal Putty directly onto the component or the heatsink enclosure. Assemble the unit;
the putty will naturally deform and adapt perfectly to the component profile under standard fastening pressure.
Excess material can be wiped clean easily.